Datasheet

Everlight Electronics Co., Ltd. http://www.everlight.com Rev.:1.2 Page: 6 of 6
Device No.:DSE-671-101 ECN：
67-21UWC/1B/TR8
Soldering heat reliability ( DIP ) Reflow Temp / Time
Soldering Iron
Basic spec is ≦5 sec when 260℃.If temperature is higher, time should be shorter (+10℃→
-1sec). Power dissipation of Iron should be smaller than 15 W , and temperature should be
controllable. Surface temperature of the device should be under 230 ℃.
Rework
1. Customer must finish rework within 5 sec under 245℃.
2. The head of iron can not touch copper foil.
3. Twin-head type is preferred.
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EVERLIGHT ELECTRONICS CO., LTD. Tel: [phone]
Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: [phone]
Tucheng, Taipei 236, Taiwan, R.O.C http://www.everlight.com