Data Sheet

6 Electrical Characteristics
6.6 Reflow Profile
50
150
0
25
1 ~ 3 ℃/s
0
200
250
200
–1 ~ –5 ℃/s
Cooling zone
100
217
50
100 250
Reflow zone
217 ℃ 60 ~ 90 s
Temperature (℃)
Preheating zone
150 ~ 200 ℃ 60 ~ 120 s
Ramp-up zone
Peak Temp.
235 ~ 250 ℃
Soldering time
> 30 s
Time (sec.)
Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s
Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy
Figure 4: Reflow Profile
Note:
Solder the module in a single reflow.
Espressif Systems 14
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ESP32-WROVER-E & ESP32-WROVER-IE Datasheet V1.4