Data Sheet

5. Electrical Characteristics
5.6 Reflow Profile
50
150
0
25
1 ~ 3℃/s
0
200
250
200
-1 ~ -5℃/s
Cooling zone
100
217
50
100 250
Reflow zone
!217℃ 60 ~ 90s
Temperature (℃)
Preheating zone
150 ~ 200℃ 60 ~ 120s
Ramp-up zone
Peak Temp.
235 ~ 250℃
Soldering time
> 30s
Time (sec.)
Ramp-up zone — Temp.: <150℃ Time: 60 ~ 90s Ramp-up rate: 1 ~ 3℃/s
Preheating zone — Temp.: 150 ~ 200℃ Time: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8℃/s
Reflow zone — Temp.: >217℃ 7LPH60 ~ 90s; Peak Temp.: 235 ~ 250℃ (<245℃ recommended) Time: 30 ~ 70s
Cooling zone — Peak Temp. ~ 180℃ Ramp-down rate: -1 ~ -5℃/s
Solder — Sn&Ag&Cu Lead-free solder (SAC305)
Figure 2: Reflow Profile
Espressif Systems 12 ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet V1.8