Data Sheet

5. ELECTRICAL CHARACTERISTICS
Parameter Conditions Min Typ Max Unit
Adjacent channel transmit power
F = F0 + 1 MHz - -14.6 - dBm
F = F0 - 1 MHz - -12.7 - dBm
F = F0 + 2 MHz - -44.3 - dBm
F = F0 - 2 MHz - -38.7 - dBm
F = F0 + 3 MHz - -49.2 - dBm
F = F0 - 3 MHz - -44.7 - dBm
F = F0 + > 3 MHz - -50 - dBm
F = F0 - > 3 MHz - -50 - dBm
∆ f1
avg
- - - 265 kHz
∆ f2
max
- 247 - - kHz
∆ f2
avg
/∆ f1
avg
- - -0.92 - -
ICFT - - -10 - kHz
Drift rate - - 0.7 - kHz/50 µs
Drift - - 2 - kHz
5.4 Reflow Profile
Temperature (℃)
Soldering time
> 30s
Ramp-up zone
Time (sec.)
50
150
0
25
1 ~ 3℃/s
0
200
250
200
Peak Temp.
235 ~ 250℃
3 ~ 5℃/s
Cooling down zone
Preheating zone
150 ~ 200℃ 60 ~ 120s
100
217
50
100 250
Ramp-up zone — Temp.: <150℃ Time: 60 ~ 90s Ramp-up rate: 1 ~ 3℃/s
Preheating zone — Temp.: 150 ~ 200℃ Time: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8℃/s
Reflow soldering zone — Peak Temp.: 235 ~ 250℃ (<245℃ recommended) Time: 30 ~ 70s
Cooling down zone — Temp.: 217 ~ 170℃ Ramp-down rate: 3 ~ 5℃/s
Solder — Sn&Ag&Cu Lead-free solder (SAC305)
Figure 2: Reflow Profile
Espressif Systems 17 ESP32-WROVER Datasheet V1.2