User's Manual

CONFIDENTIAL
!
4. Electrical Characteristics
4.4. Reflow Profile

Figure 4-1. ESP-WROOM-5C Reflow Profile
📖 Notes:
① Modem-sleep mode is used in the applications that require the CPU to be working, as in PWM or I2S
applications. According to 802.11 standards (like U-APSD), it shuts down the Wi-Fi Modem circuit while
maintaining a Wi-Fi connection with no data transmission to optimize power consumption. E.g. in DTIM3,
maintaining a sleep of 300 ms with a wakeup of 3 ms cycle to receive AP’s Beacon packages at interval
requires about 15 mA current.
② During Light-sleep mode, the CPU may be suspended in applications like Wi-Fi switch. Without data
transmission, the Wi-Fi Modem circuit can be turned off and CPU suspended to save power
consumption according to the 802.11 standards (U-APSD). E.g. in DTIM3, maintaining a sleep of 300 ms
with a wakeup of 3 ms to receive AP’s Beacon packages at interval requires about 0.9 mA current.
③ During Deep-sleep mode,Wi-Fi is turned off. For applications with long time lags between data
transmission, e.g. a temperature sensor that detects the temperature every 100s, sleeps for 300s and
wakes up to connect to the AP (taking about 0.3 ~ 1s), the overall average current is less than 1 mA. The
current of 20 μA is acquired at the voltage of 2.5V.
50
150
0
25
1 ~ 3℃/s
0
200
250
200
-1 ~ -5℃/s
Cooling zone
100
217
50
100 250
Reflow zone
!217℃ 60 ~ 90s
Temperature (℃)
Preheating zone
150 ~ 200℃ 60 ~ 120s
Ramp-up zone
Peak Temp.
235 ~ 250℃
Soldering time
> 30s
Time (sec.)
Ramp-up zone — Temp.: <150℃ Time: 60 ~ 90s Ramp-up rate: 1 ~ 3℃/s
Preheating zone — Temp.: 150 ~ 200℃ Time: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8℃/s
Reflow zone — Temp.: >217℃ 7LPH60 ~ 90s; Peak Temp.: 235 ~ 250℃ (<245℃ recommended) Time: 30 ~ 70s
Cooling zone — Peak Temp. ~ 180℃ Ramp-down rate: -1 ~ -5℃/s
Solder — Sn&Ag&Cu Lead-free solder (SAC305)
Espressif !
2019.01
11