User's Manual

CONFIDENTIAL
8. Product Handling
8. Product Handling
8.1 Storage Condition
The products sealed in Moisture Barrier Bag (MBB) should be stored in a noncondensing atmospheric environment
of < 40 °C/90%RH.
MSL 3 and floorlife: 168 hrs �30 °C/60%RH
8.2 ESD
• Human body model (HBM): 2000 V
• Charged-device model (CDM): 500 V
• Air discharge: 8000 V
• Contact discharge: 6000 V
8.3 Reflow Profile
50
150
0
25
1 ~ 3℃/s
0
200
250
200
-1 ~ -5℃/s
Cooling zone
100
217
50
100 250
Reflow zone
!217℃ 60 ~ 90s
Temperature (℃)
Preheating zone
150 ~ 200℃ 60 ~ 120s
Ramp-up zone
Peak Temp.
235 ~ 250℃
Soldering time
> 30s
Time (sec.)
Ramp-up zone — Temp.: <150℃ Time: 60 ~ 90s Ramp-up rate: 1 ~ 3℃/s
Preheating zone — Temp.: 150 ~ 200℃ Time: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8℃/s
Reflow zone — Temp.: >217℃ 7LPH60 ~ 90s; Peak Temp.: 235 ~ 250℃ (<245℃ recommended) Time: 30 ~ 70s
Cooling zone — Peak Temp. ~ 180℃ Ramp-down rate: -1 ~ -5℃/s
Solder — Sn&Ag&Cu Lead-free solder (SAC305)
Figure 7: Reflow Profile
Espressif Systems
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ESP32-S2-WROVER User Manual V0.1