Specifications

72
Two-Point Mounting Type
Temporary tightening = 1 then 2
Final tightening = 2 then 1
1
2
IGBT Handling & Replacement
Since IGBT gates are insulated from any other conducting region, care should be taken to prevent static
build up, which could possibly damage gate oxides. All IGBT modules are shipped from the factory with
conductive foam contacting the gate and emitter sense pins. Always ground parts touching gate pins
during installation. In general, standard ESD precautions application to FETs should be followed.
Other handling precautions that should also be observed are as follows:
• Use grounded work station with grounded oors and grounded wrist straps when handling devices.
• Use a 100Ω resistor in series with the gate when performing curve tracer tests.
• Never install devices into systems with power connected to the system.
• Use soldering irons with grounded tips when soldering to gate terminals.
When mounting IGBT modules on a heatsink, certain precautions should be taken to prevent any dam-
age against a sudden torque. If a sudden torque (“one-sided tightening”) is applied at only one mount-
ing terminal the ceramic insulation plate or silicon chip inside the module may get damaged. The
mounting screws are to be fastened in the order shown in gure below. Also, care must be taken to
achieve maximum contact (i.e. minimum contact thermal resistance) for the best heat dissipation. Appli-
cation of a thermal pad on the contact surface improves its thermal conductivity. See Replacement Parts
section for the required pad.
If an IGBT has failed, BOTH IGBTs must be replaced. Failure of either transistor always subjects the recti-
er bridge to a high current surge, which substantially shortens its life. The rectier bridge should be
replaced if the transistors have failed.
6.0 IGBT Testing
Torque
Mounting ..............26 in-lb
Electrical Connection .........19 in-lb
Completely clean mating surfaces and apply thermal conducting
paste / tape.
NOTE:
Small amounts of dirt between mating surfaces can
cause component failure or degraded performance;
DO NOT use silicon seal or other adhesives in place of
thermal paste.
SECTION 6 REGULAR MAINTENANCE
6.0 Maintenance
CONTENTS