Datasheet

Catalog E 074521 02/08 Edition 8 www.erni.com 17
MicroStac
®
- 0.8 mm Mezzanine Connector System
50 Pin Dual Row Version
50 Pin Dual Row Version
• Pitch 0.8 mm
• SMT process compatible
• Hermaphroditic contact design, two contact points
• One part number for interconnection saving admin and
logistic costs
• Integrated pick and place pad and very low weight for high
speed assembly
• Positioning pegs
• Secure standing while solder process, large solder pads
• Black insulation body and silver terminals for optical vision
system (contrast measuring methode)
• Polarization and pre-alignment while mating
• Component weight 50 Pin: 0.96 g
• Large wipe length 1.5 mm
• Mated stacking height 5 mm
Dimensional Drawing
3,75
3,98
7,3
4,55
3,32
3,1
Koplanarität der Anschlüsse 0,1mm
Coplanarity area of termination 0,1mm
±0,03
4,15
21,5
1
-0,03
0,6 0,8
-0,03
22,5
<
_
<
_
Pos. 1
7,25
0,8
24 x 0,8 = 19,2
0,425
3,9
Leiterplatten-Layout Vorschlag
PCB-Layout Proposal
Pos. 1
Bezugslinie für gestecktes Paar
Referenceline for mated pair
±0,03
+0,03
0,65
±0,05
+0,03
7,6
3,47
0,44
0,8
0,85
19,224 x 0,8 =
1,15±0,03
21,5
3,4
All dimensions in mm