Datasheet

Catalog E 074521 02/08 Edition 8 www.erni.com 13
MicroStac
®
- 0.8 mm Mezzanine Connector System
12 Pin Single Row Version
12 Pin Single Row Version
Pitch 0.8 mm
SMT process compatible
Hermaphroditic contact design, two contact points
One part number for interconnection saving admin and
logistic costs
Integrated pick and place pad and very low weight for high
speed assembly
• Positioning pegs
Secure standing while solder process, large solder pads
Black insulation body and silver terminals for optical vision
system (contrast measuring methode)
Polarization and pre-alignment while mating
Component weight 12 Pin: 0.26 g
Large wipe length 1.5 mm
Mated stacking height 5 mm
Dimensional Drawing
1,45
4,35
0,425
1,15
3,9
<
_
<
_
Koplanarität der Anschlüsse
0,1mm
Coplanarity area of termination 0,1mm
Po s. 1
0,8
11 x 0,8 =
3,2
8,8
0,9 3,95
±0,03
11,1
0,6
-0,03
0,8
-0,03
1
11,96
0,8
11 x 0,8 = 8,8
1,65
1,15±0,03
Pos. 1
Leiterplatten-Layout Vorschlag
PCB-Layout Proposal
Bezugslinie für gestecktes Paar
Referenceline for mated pair
+0,03
0,65
+0,03
±0,03
11,1
0,44
0,85
1,35
4,3
All dimensions in mm