Specifications

Rev. 2.1 EPSON 6–3
S1D12400 Series
S1D12400
Series
4. PAD
Pad Layout
S1D124
*******
Digits for CGROM pattern change
Number of display line
00: 4-line display
01: 3-line display
02: 2-line display
Chip size: 8.70 × 2.80 mm
Pad pitch: 90 µm (Min.)
Chip thickness (reference value): 625 ± 50 µm (S1D124
**
D
****
)
Au bump specifications
Bump size A TYPE 60.0 µm × 81.5 µm
B TYPE 81.5 µm × 60.0 µm
C TYPE 85.0 µm × 85.0 µm
D TYPE 60.0 µm × 85.0 µm
Bump height (reference value) 22.5 µm ± 5.5 µm
(For bump types, refer to the pad coordinate diagram.)
210
1
186
185 101
100
75
23456 74
: DUMMY PAD
S1D12400 Series
D124
*
D
**
Die No.
. . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . .
. . . . .
. . . . .
(0, 0)
Y
X
: PAD
↑↑
Note: The board of this IC has VDD potential. It is recommended to stabilize power supply by connecting the
board to the V
DD potential at the time of mounting.