Specifications

Rev. 1.4 EPSON 2–3
S1D12200
Series
S1D12200 Series
4. CHIP SPECIFICATION
S1D12200D
****
/S1D12201D
****
/S1D12210D
****
S1D122
**
D
****
Digits prepared for CGROM pattern changes
Chip size: 7.70 × 2.77 mm
Pad pitch: 100 µm (Minimum)
Chip thickness (for reference): 625 ± 25 µm (S1D122
**
D
**
A
*
)
(S1D122
**
D
**
B
*
)
1) A1 pad specifications
Pad size on Y side: 135 µm × 75 µm
Pad size on X side: 75 µm ×135 µm
2) Au bump specifications
Bump size on Y side: 129 µm × 69 µm
Bump size on X side: 69 µm ×129 µm
Bump height (for reference) 22.5 µm ± 5.5 µm
<Fuse Pines>
1) Al pad. pad size 86 µm × 75 µm
2) Au bump
Bump size 80 µm × 69 µm
146
147
165
74
54
1
73
62
56
55
63
:DUMY PAD
:PAD
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