Specifications

4–4 EPSON Rev. 1.9
S1D12300 Series
4. PAD
Pad layout
S1D12300D
****
1/30 duty 12 columns + 1 signal column
S1D12301D
****
1/23 duty 12 columns + 1 signal column
S1D12302D
****
1/16 duty 12 columns + 1 signal column
S1D12303D
****
1/16 duty 16 columns
#1 Column for CG ROM pattern change
Chip size: 10.23 × 3.11 mm
Pad pitch: 110 µm (Min.)
Chip thickness: 625 (S1D123
**
D
**
A
*
, S1D123
**
D
**
B
*
)
525 (S1D123
**
D
**
C
*
, S1D123
**
D
**
E
*
)
1) A1 pad specification (S1D123
**
D
**
A
*
)
Pad size: A 86 µm × 135 µm
B 135 µm × 86 µm
2) Au bump specification (S1D123
**
D
**
B
*
)
For reference:
Bump size A 80 µm × 129 µm
B 129 µm × 80 µm
Bump height 22.5 µm
↑
(0,0)
173
174
193
1 58
69
85
86