Specifications

4–2 EPSON Rev. 1.9
S1D12300 Series
S1D12300 Series Chip Specifications
Product name Duty
No. of digits No. of lines
Font
V
REG temper- Chip
Shipping form
indicated indicated ature slope thickness
S1D12300D11B
*
1/30 12 columns + 4 lines Table 6 S1D123
**
D11
**
–0.17%/°C 625µm Gold Bump Chip
1 column for signal
S1D12300D16B
*
1/30 12 columns + 4 lines Table 7 S1D123
**
D16
**
–0.17%/°C 625µm Gold Bump Chip
1 column for signal
S1D12300D16E
*
1/30 12 columns + 4 lines Table 7 S1D123
**
D16
**
–0.17%/°C 525µm Gold Bump Chip
1 column for signal
S1D12300D19B
*
1/30 12 columns + 4 lines Table 5 S1D123
**
D10
**
–0.04%/°C 625µm Gold Bump Chip
1 column for signal
S1D12300D27E
*
1/30 12 columns + 4 lines Table 6 S1D123
**
D11
**
External Input 525µm Gold Bump Chip
1 column for signal
S1D12301D10B
*
1/23 12 columns + 3 lines Table 5 S1D123
**
D10
**
–0.17%/°C 625µm Gold Bump Chip
1 column for signall
S1D12301D11E
*
1/23 12 columns + 3 lines Table 6 S1D123
**
D11
**
–0.17%/°C 525µm Gold Bump Chip
1 column for signal
S1D12301D19B
*
1/23 12 columns + 3 lines Table 5 S1D123
**
D10
**
–0.04%/°C 625µm Gold Bump Chip
1 column for signal
S1D12302D10B
*
1/16 12 columns + 2 lines Table 5 S1D123
**
D10
**
–0.17%/°C 625µm Gold Bump Chip
1 column for signal
S1D12302D11B
*
1/16 12 columns + 2 lines Table 6 S1D123
**
D11
**
–0.17%/°C 625µm Gold Bump Chip
1 column for signal
S1D12302D16B
*
1/16 12 columns + 2 lines Table 7 S1D123
**
D16
**
–0.17%/°C 625µm Gold Bump Chip
1 column for signal
S1D12302D22B
*
1/16 12 columns + 2 lines Table 5 S1D123
**
D10
**
External Input 625µm Gold Bump Chip
1 column for signal
S1D12303D10E
*
1/16 16 columns 2 lines Table 5 S1D123
**
D10
**
–0.17%/°C 525µm Gold Bump Chip
S1D12303D11B
*
1/16 16 columns 2 lines Table 6 S1D123
**
D11
**
–0.17%/°C 625µm Gold Bump Chip
S1D12303D16B
*
1/16 16 columns 2 lines Table 7 S1D123
**
D16
**
–0.17%/°C 625µm Gold Bump Chip
S1D12303D16E
*
1/16 16 columns 2 lines Table 7 S1D123
**
D16
**
–0.17%/°C 525µm Gold Bump Chip
S1D12303D22B
*
1/16 16 columns 2 lines Table 5 S1D123
**
D10
**
External Input 625µm Gold Bump Chip
S1D12303D27A
*
1/16 16 columns 2 lines Table 6 S1D123
**
D11
**
External Input 625µm AL-PAD chip
S1D12303D02E
*
1/16 16 columns 2 lines Table 7 S1D123
**
D16
**
External Input 525µm Gold Bump Chip
S1D12303D03E
*
1/16 16 columns 2 lines Table 7 S1D123
**
D16
**
–0.04%/°C 525µm Gold Bump Chip
Product name Duty
No. of digits No. of lines
Font
V
REG temper-
Shipping form
indicated indicated ature slope
S1D12300T001
*
1/30 12 columns + 4 lines Table 6 S1D123
**
D11
**
–0.17%/°C TCP, 35mm 9IP
1 columns for signal
S1D12300T00A
*
1/30 12 columns + 4 lines Table 6 S1D123
**
D11
**
–0.17%/°C TCP, 48mm 3IP
1 column for signal
S1D12300T00B
*
1/30 12 columns + 4 lines Table 5 S1D123
**
D10
**
–0.04%/°C TCP, 48mm 3IP
1 column for signal
S1D12301T00B
*
1/23 12 columns + 3 lines Table 5 S1D123
**
D10
**
External Input TCP, 48mm 3IP
1 column for signal
S1D12303T00A
*
1/16 16 columns 2 lines Table 6 S1D123
**
D11
**
–0.17%/°C TCP, 48mm 3IP
S1D12303T00B
*
1/16 16 columns 2 lines Table 5 S1D123
**
D10
**
–0.17%/°C TCP, 48mm 3IP
S1D12300 Series TCP Specifications