Specifications

S1D15300 Series
Rev.1.4 EPSON 5–3
4. PAD LAYOUT
S1D15300 series chips
151
52
86
87 137
138
172
Die No.
Chip Size: 6.65x4.57 mm
Pad Pitch: 118 µm (Min.)
S1D1530
*
D
**
A
*
(Al-pad chip)
Pad Center Size: 90x90 µm
Chip Thickness: 300 µm
S1D1530
*
D
**
B
*
(Al-bump chip)
Bump Size: 76x76 µm
Bump Height: 23µm (Typ.)
Chip Thickness: 625 µm