Specifications

SED1560 Series
7–2 EPSON
PAD LAYOUT
Chip size : 8.08 × 5.28 mm
Pad pitch : 100 µm (Min.)
Chip thickness : 625 µm
: 300 µm (Al-pad)
• Au-Bump
Bump size A : 103 µm × 95 µm (Typ.) (Pad No. 1 ~ 6, 18, 36 ~ 42,
44 ~ 49)
Bump size B : 69 µm × 95 µm (Typ.) (other then the above)
Bump hight : 23 µm (Typ.)
• Al-pad
Pad size A : 111 µm × 102 µm (Typ.) (Pad No. 1 ~ 6, 18, 36 ~ 42,
44 ~ 49)
Bump size B : 77 µm × 99 µm (Typ.) (Other then the above)
O0
O45
V
5
V
4
V
3
V
2
V
1
V V V
5
V CAP2– CAP2+ CAP1– CAP1+ V
SS
T1 T2 OSC1 OSC2 CL FR SYNC CLO DYO D7 D6 D5 D4 D3 D2 D1 D0 V RD WR A0 C86 CS2 CS1 P/S S1 SCL RES M/S V
DD
V
1
V
2
V
3
V
4
V
5
DD R OUT
SS
O46
O120
O121
COM1
O165
0B D156✻D
170
1
216
49
95