S1C6P466 TECHNICAL MANUAL EPSON 129
CHAPTER 11: PAD LAYOUT
CHAPTER 11 PAD LAYOUT
11.1 Diagram of Pad Layout
Chip thickness: 400 µm
Pad opening: 95 µm
X
Y
(0, 0)
5.30 mm
5.30 mm
Die No.
15101520253035
40
45
50
55
60
65
70
75 80 85 90 95 100 105
110
115
120
125
130
135
140
