Specifications

I-22 EPSON S1C62N82 TECHNICAL HARDWARE
CHAPTER 4: PERIPHERAL CIRCUITS AND OPERATION (Oscillation Circuit)
4.2
V DD
C GX
X'tal
OSC2
OSC1
R
R
DX
C DX
V DD
To CPU and peripheral
circuits
S1C62N82 Series
FX
As Figure 4.2.1 indicates, the crystal oscillation circuit can
be configured simply by connecting the crystal oscillator
(X'tal) between terminals OSC1 and OSC2 to the trimmer
capacitor (CGX) between terminals OSC1 and VDD.
CR oscillation circuit
For the S1C62N82 Series, CR oscillation circuit (typ. 32.768
kHz) may also be selected by a mask option. Figure 4.2.2 is
the block diagram of the OSC1 CR oscillation circuit.
OSC2
OSC1
C
To CPU and
peripheral circuits
The S1C62N82 Series
R CR
CR
As Figure 4.2.2 indicates, the CR oscillation circuit can be
configured simply by connecting the resistor (RCR) between
pins OSC1 and OSC2 since capacity (CCR) is built-in.
See Chapter 6, "ELECTRICAL CHARACTERISTICS" for RCR
value.
Fig. 4.2.1
OSC1 crystal oscillation circuit
Fig. 4.2.2
OSC1 CR oscillation circuit
Oscillation Circuit
Crystal oscillation circuit
The S1C62N82 Series has a built-in OSC1 crystal oscillation
circuit (Typ. 32.768 kHz). As an external element, the OSC1
crystal oscillation circuit generates the operating clock for
the CPU and peripheral circuitry by connecting the crystal
oscillator (Typ. 32.768 kHz) and trimmer capacitor (5–25
pF).
Figure 4.2.1 is the block diagram of the OSC1 crystal oscilla-
tion circuit.
OSC1 oscillation
circuit