Specifications

I-90 EPSON S1C6S2N7 TECHNICAL HARDWARE
CHAPTER 8: PAD LAYOUT
CHAPTER 8 PAD LAYOUT
8.1 Diagram of Pad Layout
Y
X
(0, 0)
35
20
1
5
10
15
25
30
40
45
50
55
Die No.
Chip size: 3,130 µm (X) x 3,390 µm (Y)