Specifications

S1C62740 TECHNICAL HARDWARE EPSON I-133
CHAPTER 9: PAD LAYOUT
PAD LAYOUTCHAPTER 9
9.1 Diagram of Pad Layout
X
(0, 0)
Y
1
5.35 mm
5.5 mm
510152025
30
35
40
45
50
55
60 65 70 75 80
85
90
95
100
105
109
Chip thickness: 400 µm
Pad opening: 100 µm