Specifications

2 C33 Macro Specifications
S1C33 ASIC DESIGN GUIDE
EPSON
21
EMBEDDED ARRAY S1X50000 SERIES
3) 2.0V single power source
(Unless otherwise specified: V
DD
=1.8V to 2.2V, V
SS
=0V, Ta=–40 to +85°C)
2.6.4 Current Consumption
The current consumption of C33 ICs is defined as that for the C33 macro block V
DD
system. The
current consumption of user circuits and functional blocks other than C33 macros is not included in
these ratings.
1) 3.3V single power source
(Unless otherwise specified: V
DD
=2.7V to 3.6V, V
SS
=0V, Ta=–40 to +85°C)
Item Symbol Condition Min. Typ. Max. Unit
*
Input leakage current I
LI
-1 – 1 µA
Off-state leakage current I
OZ
-1 – 1 µA
High-level output voltage V
OH
I
OH
=-0.6mA, V
DD
=Min. V
DD
-0.2 – – V
Low-level output voltage V
OL
I
OL
=0.6mA, V
DD
=Min. – – 0.2 V
High-level input voltage V
IH
CMO level, V
DD
=Max. 1.6 – – V
Low-level input voltage V
IL
CMO level, V
DD
=Min. – – 0.3 V
Positive trigger input voltage V
T+
CMO schmitt 0.4 – 1.6 V
Negative trigger input voltage V
T-
CMO schmitt 0.3 – 1.4 V
Hysteresis voltage V
H
CMO schmitt 0 – – V
Pull-up resistor R
PU
V
I
=0V 60 240 600 KΩ
Pull-down registor R
PD
V
I
=V
DD
(#ICEMD) 30 120 300 KΩ
Input pin capacitance C
I
f=1MHz, V
DD
=0V – – 10 pF
Output pin capacitance C
O
f=1MHz, V
DD
=0V – – 10 pF
I/O pin capacitance C
IO
f=1MHz, V
DD
=0V – – 10 pF
Item Symbol Condition Min. Typ. Max. Unit
*
20MHz – 25 35 mA
Operating current I
DD1
When CPU is operating 33MHz – 40 60 mA
50MHz – 65 85 mA
20MHz – 12 16 mA
Operating current I
DD2
HALT mode 33MHz – 20 26 mA
50MHz – 30 40 mA
Operating current I
DD3
HALT2 mode, 20MHz – 1.8 2.5 mA
Operating current I
DD4
Sleep mode – 1 30 µA
Clock timer operation current I
DDCT
When clock timer only is oper-
ating
OSC1oscillation: 32KHz
– 7 – µA