Datasheet
6
Ver.20170607
[ 7 ] Notes
1. Max. three(3) times re-flow is allowed. Its recommended to manually solder when not enough/no solder detected.( Using
soldering iron at +350 C Max within 5 seconds)
2. Patterning on a board should follow our company recommended pattern.
3. Too much exciting shock or vibration may cause deterioration on damage.
The product may damage depends on the condition such as a shock in assembly machinery.
Please check your process condition in advance to minimize and maintain the shock level.
4. It is recommended to do patterning to the oscillator as short as possible. Abnormal oscillation may happened if the line is
too long.
5. Condensation may occur when products are used/stored under remarkable temperature change.
6. This product may be affected to ultrasonic cleaning. It is depends on the cleaning conditions (Cleaning machine
type/power/time/content/position etc.). The warranty will not cover any damage due to this type of usage. Check
conditions prior to use.
7. When the substrate of oscillation become dewy, the crystal frequency is changed or stopped. Please use under without the
dewfall.
8. Applying excessive excitation Drive Level to the crystal Unit may cause deterioration damage.
9. Few data or readings taken at user side may be different from our company’s data. Confirmation of the different value is
necessary before application.
10. To avoid malfunction, no pattern across or near the crystal is allowed.
11. Start up time of oscillation may be increased or no oscillation may occur unless adequate negative resistance is allocated
in the oscillation circuit In order to avoid this, please provide enough negative resistance to the circuit design.
How to check the negative resistance
(1) Connect the resister(R) to the circuit in series with the crystal Unit.
(2) Adjust R so that oscillation can start (or stop).
(3) Measure R when oscillation just start (or stop) in above (2).
(4) Get the negative resistance
-R=R+CI value.
(5) Recommended -R
[-R] > CI 5
12. Please refer to packing specification for the storage method and packing standard.
INV
Rf
R
Rd
X’tal
Cg
Cd