Specifications

IntroductionP2-112A
Page 1-3
packaging technology and each of the physical elements of the product are referred
to using accurate technical descriptions. This allows clear reference to the products
as just a processor. This is the model used in past packaging technologies like PGA,
TCP, PQFP, DIP, etc.
S.E.C. Cartridge Terminology
• Pentium
®
II or Deschutes Processor
The new enclosed card packaging technology is called a “Single Edge Contact
cartridge.” This is similar to previous names for packaging technology such as
PGA or TCP.
• Processor card
The green PCB (with or without components on it)
• Processor core
The silicon on the PLGA package on the PCB
• Cover
The plastic cover on the opposite side from the thermal plate.
• Slot 1
The slot that the S.E.C. cartridge plugs into, just as the Pentium
®
Pro processor
uses Socket 8.
• Retention mechanism
Formerly ‘retention module’ the dual posts, etc. that holds the cartridge in
place.
• Thermal plate
The heatsink attachment plate.
• Heat sink supports
The support pieces that are mounted on the mainboard to provide added
Figure 1: Pentium
®
II or Deschutes
Processor CPU with S.E.C.
Cartridge
Processor
Printed Circuit Board
Thermal Plate
Cover
support for heatsinks.
The L2 cache (TagRAM, PBSRAM)
components keep standard industry
names.
The Pentium
®
II or Deschutes Processor
is the first product to utilize the S.E.C.
cartridge technology and Slot 1
connector. Unless otherwise noted, any
references to “Pentium
®
II Processor,”
“Pentium
®
II or Deschutes Processor/
Slot 1 processor” or “Deschutes Proces-
sor” will apply to both the Pentium
®
II