Datasheet

1.2 Resistance to soldering heat

Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1.

Conditions:

Series Solder bath temperature Soldering time

MKT boxed (except 2.5 × 6.5 × 7.2 mm)

coated

uncoated (lead spacing >10 mm)

260 ±5 °C 10 ±1s

MFP

MKP

(lead spacing >7.5 mm)

MKT boxed (case 2.5 × 6.5 × 7.2 mm)

5 ±1s

MKP

MKT

(lead spacing ≤7.5 mm)

uncoated (lead spacing ≤10 mm)

insulated (B32559)

<4 s

recommended soldering

profile for MKT uncoated

(lead spacing ≤ 10 mm) and

insulated (B32559)

Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane

Shield Heat-absorbing board, (1.5 ±0.5) mm thick, between

capacitor body and liquid solder

Evaluation criteria:

Visual inspection No visible damage

ΔC/C

2% for MKT/MKP/MFP

5% for EMI suppression capacitors

tan δ As specified in sectional specification

B81123

Y1/500VAC

Page9of19Please read Cautions and warnings and

Important notes at the end of this document.