Datasheet

Testing and Standards
Test Reference Conditions of test Performance requirements
Electrical
parameters
IEC
60384-14:2013
Voltage Proof:
Between terminals:
4000 V AC, 1 min
Terminals and enclosure:
4000 V AC, 1 min
Insulation resistance, R
ins
Capacitance, C
Dissipation factor, tan δ
Within specified limits
Robustness
of termina-
tions
IEC
60068-2-21:2006
Tensile strength (test Ua1)
Capacitance and tan δ
within specified limits
Wire diameter Tensile
force
0.5 < d
1
≤ 0.8 mm
0.8 < d
1
≤ 1.25 mm
10 N
20 N
Resistance
to soldering
heat
IEC
60068-2-20:2008,
test Tb,
method 1A
Solder bath temperature at
260 ±5 °C, immersion for
10 seconds
ΔC/C
0
≤ 5%
tan δ within specified limits
Rapid
change of
temperature
IEC
60384-14:2013
T
A
= lower category temperature
T
B
= upper category temperature
Five cycles, duration t = 30 min.
No visible damage
ΔC/C
0
 ≤ 5%
tan δ within specified limits
Vibration IEC
60384-14:2013
Test F
C
: vibration sinusoidal
Displacement: 0.75 mm
Accleration: 98 m/s
2
Frequency: 10 Hz ... 500 Hz
Test duration: 3 orthogonal axes,
2 hours each axe
No visible damage
Bump IEC
60384-14:2013
Test Eb: Total 4000 bumps with
400 m/s
2
mounted on PCB
6 ms duration
No visible damage
ΔC/C
0
 ≤ 5%
tan δ within specified limits
Climatic
sequence
IEC
60384-14:2013
Dry heat Tb / 16 h
Damp heat cyclic, 1
st
cycle
+55 °C / 24 h / 95% ... 100% RH
Cold Ta/2h
Damp heat cyclic, 5 cycles
+55 °C / 24 h / 95% ... 100% RH
No visible damage
ΔC/C
0
 ≤ 5%
Δ tan δ ≤ 0.008 for C ≤ 1 μF
Δ tan δ ≤ 0.005 forC>1μF
Voltage proof
R
ins
≥ 50% of initial limit
B81123
Y1/500VAC
Page7of19Please read Cautions and warnings and
Important notes at the end of this document.