Film Capacitors EMI Suppression Capacitors (MKP) Series/Type: B81123 Date: November 2019 © TDK Electronics AG 2019. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without TDK Electronics' prior express consent is prohibited.
EMI suppression capacitors (MKP) B81123 Y1 / 500 V AC Typical applications Y1 class for interference suppression "Line to ground" applications Double insulation Dimensional drawing Climatic Max. operating temperature: 110 °C Climatic category (IEC 60068-1:2013): 40/110/56 Construction Dielectric: polypropylene (MKP) Internal series connection Plastic case (UL 94 V-0) Epoxy resin sealing (UL 94 V-0) Features Self-healing properties RoHS-compatible AEC-Q200D compliant Dimensions in mm Lead spacing ±0.
B81123 Y1 / 500 V AC Approvals Approval Standards marks Notes: Certificate EN 60384-14, IEC60384-14 Ed. 4 ENEC-01093 UL 60384-14:2014, CSA E60348-14 E97863 Effective January 2014, only for EMI supression capacitors: UL 60384-14:2014 certification replaces both UL 1414:2000 and UL 1283:2005 standards. CSA C22.2 No.1:2004 and CSA C22.2 No.8:2013 are replaced by CSA E60384-14:2013. References like 1414, 1283 are removed from the capacitor marking.
B81123 Y1 / 500 V AC Ordering codes and packing units Lead spacing mm 15 22.5 CR μF 0.0010 0.0015 0.0022 0.0033 0.0047 0.0056 0.0068 0.010 Max. dimensions w×h×l mm 5.0 × 10.5 × 18.0 6.0 × 11.0 × 18.0 7.0 × 12.5 × 18.0 8.5 × 14.5 × 18.0 9.0 × 17.5 × 18.0 7.0 × 16.0 × 26.5 8.5 × 16.5 × 26.5 10.5 × 18.5 × 26.5 Ordering code (composition see below) B81123C1102M*** B81123C1152M*** B81123C1222M*** B81123C1332M*** B81123C1472M*** B81123C1562M*** B81123C1682M*** B81123C1103M*** Ammo pack pcs.
B81123 Y1 / 500 V AC Technical data Reference standard: IEC 60384-14:2013 / UL 60384-14:2014. All data given at T = 20 °C, unless otherwise specified. Max. operating temperature Top,max +110 °C -3 at 1 kHz 1.0 Dissipation factor tan δ (in 10 ) at 20 °C (upper limit values) at 100 kHz 5.0 Insulation resistance Rins or time 30 000 MΩ constant τ = CR Rins at 20 °C, rel. humidity ≤ 65% (minimum as-delivered values) DC test voltage 4800 V, 2 s The repetition of this DC voltage test may damage the capacitor.
B81123 Y1 / 500 V AC Pulse handling capability "dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal voltages, expressed in V/μs. "k0" represents the maximum permissible pulse characteristic of the waveform applied to the capacitor, expressed in V2/μs. Note: The values of dV/dt and k0 provided below must not be exceeded in order to avoid damaging the capacitor. dV/dt and k0 values Lead spacing dV/dt in V/μs k0 in V2/μs 15 mm 22.
B81123 Y1 / 500 V AC Testing and Standards Test Reference Electrical IEC parameters 60384-14:2013 Conditions of test Voltage Proof: Between terminals: 4000 V AC, 1 min Terminals and enclosure: 4000 V AC, 1 min Insulation resistance, Rins Capacitance, C Dissipation factor, tan δ Robustness IEC Tensile strength (test Ua1) of termina- 60068-2-21:2006 Wire diameter Tensile tions force 0.5 < d1 ≤ 0.8 mm 10 N 0.8 < d1 ≤ 1.
B81123 Y1 / 500 V AC Test Reference Damp heat, IEC steady 60384-14:2013 state Impulse test Endurance IEC 60384-14:2013 Passive IEC flammability 60384-14:2013 Conditions of test Test Ca 40 °C / 93% RH / 56 days 3 impulses Tb / 1.7 VR / 1000 hours, 1000 VRMS for 0.1 s every hour Flame applied for a period of time depending on capacitor volume Performance requirements No visible damage ΔC/C0 ≤ 5% Δ tan δ ≤ 0.008 for C ≤ 1 μF Δ tan δ ≤ 0.
B81123 Y1 / 500 V AC 1.2 Resistance to soldering heat Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1. Conditions: Series Solder bath temperature Soldering time MKT boxed (except 2.5 × 6.5 × 7.2 mm) 260 ±5 °C coated uncoated (lead spacing >10 mm) MFP MKP (lead spacing >7.5 mm) MKT boxed (case 2.5 × 6.5 × 7.2 mm) MKP (lead spacing ≤7.
B81123 Y1 / 500 V AC 1.3 General notes on soldering Permissible heat exposure loads on film capacitors are primarily characterized by the upper category temperature Tmax. Long exposure to temperatures above this type-related temperature limit can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical characteristics.
B81123 Y1 / 500 V AC Body temperature should follow the description below: MKP capacitor During pre-heating: Tp ≤110 °C During soldering: Ts ≤120 °C, ts ≤45 s MKT capacitor During pre-heating: Tp ≤125 °C During soldering: Ts ≤160 °C, ts ≤45 s When SMD components are used together with leaded ones, the film capacitors should not pass into the SMD adhesive curing oven. The leaded components should be assembled after the SMD curing step. Leaded film capacitors are not suitable for reflow soldering.
B81123 Y1 / 500 V AC Cautions and warnings Do not exceed the upper category temperature (UCT). Do not apply any mechanical stress to the capacitor terminals. Avoid any compressive, tensile or flexural stress. Do not move the capacitor after it has been soldered to the PC board. Do not pick up the PC board by the soldered capacitor. Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified lead spacing. Do not exceed the specified time or temperature limits during soldering.
B81123 Y1 / 500 V AC Topic Safety information Soldering Do not exceed the specified time or temperature limits during soldering. Use only suitable solvents for cleaning capacitors. When embedding finished circuit assemblies in plastic resins, chemical and thermal influences must be taken into account.
B81123 Y1 / 500 V AC Display of ordering codes for TDK Electronics products The ordering code for one and the same product can be represented differently in data sheets, data books, other publications, on the company website, or in order-related documents such as shipping notes, order confirmations and product labels. The varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products.
B81123 Y1 / 500 V AC Symbols and terms Symbol α αC A βC C CR ΔC ΔC/C ΔC/CR dt Δt ΔT Δtan δ ΔV dV/dt ΔV/Δt E ESL ESR f f1 f2 fr FD FT i IC English Heat transfer coefficient Temperature coefficient of capacitance Capacitor surface area Humidity coefficient of capacitance Capacitance Rated capacitance Absolute capacitance change Relative capacitance change (relative deviation of actual value) Capacitance tolerance (relative deviation from rated capacitance) Time differential Time interval Absolute temperat
B81123 Y1 / 500 V AC Symbol IRMS iz k0 LS λ λ0 λtest Pdiss Pgen Q ρ R R Ri Rins RP RS S t T τ tan δ tan δD tan δP tan δS TA Tmax Tmin tOL Top TR Tref tSL English (Sinusoidal) alternating current, root-mean-square value Capacitance drift Pulse characteristic Series inductance Failure rate Constant failure rate during useful service life Failure rate, determined by tests Dissipated power Generated power Heat energy Density of water vapor in air Universal molar constant for gases Ohmic resistance of discharg
B81123 Y1 / 500 V AC Symbol VAC VC VC,RMS English AC voltage Category voltage Category AC voltage VCD Vch VDC VFB Vi Vo Vop Vp Vpp VR Corona-discharge onset voltage Charging voltage DC voltage Fly-back capacitor voltage Input voltage Output voltage Operating voltage Peak pulse voltage Peak-to-peak voltage Impedance Rated voltage Amplitude of rated AC voltage R VRMS German Wechselspannung Kategoriespannung (Sinusförmige) Kategorie-Wechselspannung Teilentlade-Einsatzspannung Ladespannung Gleichspannung
Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned.
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