Datasheet
Testing and Standards
Test Reference Conditions of test Performance
requirements
Electrical
Parameters
IEC 60384-14 Voltage Proof:
Between terminals: 4000 V AC,
1 min
Terminals and enclosure: 4000 V
AC, 1 min
Insulation resistance, R
INS
Capacitance, C
Dissipation factor, tan δ
Within specified limits
Robustness of
terminations
IEC 60068-2-21 Tensile strength (test Ua1)
Capacitance and tan δ
within specified limits
Wire diameter
Tensile
force
0.5 < d
1
≤ 0.8 mm
0.8 < d
1
≤ 1.25 mm
10 N
20 N
Resistance to
soldering heat
IEC 60068-2-20,
test Tb,
method 1A
Solder bath temperature at
260 ± 5 °C, immersion for
10 seconds
∆C/C
0
≤ 5%
tan δ within specified
limits
Rapid change of
temperature
IEC 60384-14 T
A
= lower category temperature
T
B
= upper category temperature
Five cycles, duration t = 30 min.
No visible damage
I∆C/C
0
I ≤ 5%
tan δ within specified
limits
Vibration IEC 60384-14 Test F
C
: vibration sinusoidal
Displacement: 0.75 mm
Accleration: 98 m/s
2
Frequency: 10 Hz ... 500 Hz
Test duration: 3 orthogonal axes,
2 hours each axe
No visible damage
Bump IEC 60384-14 Test Eb: Total 4000 bumps with
400 m/s
2
mounted on PCB
6 ms duration
No visible damage
I∆C/C
0
I ≤ 5%
tan δ within specified
limits
Climatic
sequence
IEC 60384-14
Dry heat T
B
/ 16 h.
Damp heat cyclic, 1st cycle
+ 55 °C / 24h / 95% ... 100% RH
Cold T
A
/ 2h
Damp heat cyclic, 5 cycles
+ 55 °C / 24h / 95% ... 100% rh
No visible damage
I∆C/C
0
I ≤ 5%
I∆ tan δ I ≤ 0.008,
C ≤ 1 µF
I∆ tan δ I > 0.005,
C > 1 µF
Voltage proof
R
INS
≥ 50% of initial limit
B81123
Y1 / 500 V AC
Page 7 of 19Please read Cautions and warnings and
Important notes at the end of this document.