Datasheet

Good and poor solder joints caused by amount of solder in reflow soldering.
5 Conductive adhesion
Attaching surface-mounted devices (SMDs) with electrically conductive adhesives is a commer-
cially attractive method of component connection to supplement or even replace conventional sol-
dering methods.
Electrically conductive adhesives consist of a non-conductive plastic (epoxy resin, polyimide or
silicon) in which electrically conductive metal particles (gold, silver, palladium, nickel, etc) are em-
bedded. Electrical conduction is effected by contact between the metal particles.
Adhesion is particularly suitable for meeting the demands of hybrid technology. The adhesives
can be deposited ready for production requirements by screen printing, stamping or by dis-
pensers. As shown in the following table, conductive adhesion involves two work operations fewer
than soldering.
Reflow soldering Wave soldering Conductive adhesion
Screen-print solder paste Apply glue dot Screen-print conductive adhesive
Mount SMD Mount SMD Mount SMD
Predry solder paste Cure glue Cure adhesive
Reflow soldering Wave soldering Inspect
Wash Wash
Inspect Inspect
Multilayer varistors (MLVs)
Standard series
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Important notes at the end of this document.