Datasheet

509 08/01
SMD coil former with J terminals
Material: GFR liquid crystal polymer (UL 94 V-0, insulation class to IEC 60085:
F max. operating temperature 155 °C), color code black
Solderability: to IEC 60068-2-20, test Ta, method 1 (aging 3): 350 °C, 1 s
Resistance to soldering heat: to IEC 60068-2-20, test Tb, method 1B: 350 °C, 3,5 s
permissible soldering temperature for wire-wrap connection on coil former: 400 °C, 1 s
Winding: see “Processing Notes”, page 160
Yoke
Material: Stainless spring steel (0,25 mm)
Mounting: Preferred assembly direction from the top
Cover plate
For marking and improved processing on assembly machines.
See under coil former for material and resistance to soldering heat.
Coil former Yoke
Sections A
N
mm
2
l
N
mm
A
R
value
µΩ
Terminals Ordering code
1 18,1 35,1 66,7 8 B66414-B6008-T1
2 17,1 35,1 70,5 8 B66414-B6008-T2
Yoke (ordering code per piece, 2 are required) B66414-B2000
Cover plate B66414-A7000
FEK0187-Y
12,8±0,1
6,6±0,1
1,8±0,1
Abdeckplatte
0,5 max.
Cover plate
FEK0271-J
4,4
15,6
13,6 min. 1
4,8 max.
1
FEK0329-J
0,5±0,05
5,5+0,2
7,7±0,15
2,6+0,15
Empfehlung für das
Leiterplattenlayout
17,7
11,25
3,75
0,55±0,05
0,6±0,05
2,5
11,25
3,75
1,2
5
6
7
81
2
3
4
0,2515
_
0,2
_
10,4
0,5±0,05
0,2
_
3,45
0,3
_
20,8
_
10,6 0,2
7,3 0,1
_
_
16 0,2
0,2
_
6,4
Center flange omitted for one-section version
Recommended
PCB layout
B66414Accessories
EFD 15/8/5