Datasheet

1.3.1 Solderability (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Wetting of soldering areas ≥95%.
Solder Bath temperature (°C) Dwell time (s)
SnPb 60/40 215 ±3 3 ±0.3
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 245 ±3 3 ±0.3
1.3.2 Resistance to soldering heat (test to IEC 60068-2-58)
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Leaching of side edges ≤1/3.
Solder Bath temperature (°C) Dwell time (s)
SnPb 60/40 260 ±5 10 ±1
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 260 ±5 10 ±1
1.3.3 Reflow soldering
Temperature ranges for reflow soldering acc. to IEC 60068-2-58 recommendations.
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 15 of 27Please read Cautions and warnings and
Important notes at the end of this document.