Datasheet

Special designs
Low-inductance design
For heat sink mounting
Design for optimal connection of capacitors to the heat sink when using base cooling with the
following features (refer to chapter "General technical information, 5.2 Cooling"):

Electrical insulation of the capacitors base with 2 overlapping thermal pads for optimal heat
flow (minimal thermal resistance at the capacitor base)

Minimal overall length tolerance (±0.35 mm) for mounting between heat sink and bus bar

Case with extra groove near the base for clamp mounting (recommended ring clamp
B44030A0165B ... A0190B)
This version is available only for capacitors without threaded stud and for diameters ≥64.3 mm.
Regarding ripple current and useful life, please refer to column I
AC,R
(B) in the table "Technical
data and ordering codes" and in the useful life curves.
Ordering codes:
Design Identification in 3rd
block of ordering code
Remark
Low inductance (13 nH) M003 For capacitors with diameter d ≥ 64.3 mm
For heat sink mounting M007 For capacitors with diameter d ≥ 64.3 mm and
without threaded stud
B43456, B43458
Extremely compact  85 °C
Page 6 of 18Please read Cautions and warnings and
Important notes at the end of this document.