Datasheet

Body remperature should follow the description below:
MKP capacitor
During pre-heating: T
p
≤ 110 °C
During soldering: T
s
≤ 120 °C, t
s
≤ 45 s
MKT capacitor
During pre-heating: T
p
≤ 125 °C
During soldering: T
s
≤ 160 °C, t
s
≤ 45 s
When SMD components are used together with leaded ones, the film capacitors should not pass
into the SMD adhesive curing oven. The leaded components should be assembled after the SMD
curing step.
Leaded film capacitors are not suitable for reflow soldering.
For uncoated MKT capacitors with lead spacings ≤10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 °C in the preheater phase
rapid cooling after soldering
Please refer to EPCOS Film Capacitor Data Book in case more details are needed.
B32921C/D ... B32928C/D
X2 / 305 V AC
Page 14 of 24Please read Cautions and warnings and
Important notes at the end of this document.