Datasheet

Body temperature should follow the description below:
MKP capacitor
During pre-heating: T
p
≤110 °C
During soldering: T
s
≤120 °C, t
s
≤45 s
MKT capacitor
During pre-heating: T
p
≤125 °C
During soldering: T
s
≤160 °C, t
s
≤45 s
When SMD components are used together with leaded ones, the film capacitors should not pass
into the SMD adhesive curing oven. The leaded components should be assembled after the SMD
curing step.
Leaded film capacitors are not suitable for reflow soldering.
In order to ensure proper conditions for manual or selective soldering, the body temperature of
the capacitor (T
s
) must be ≤120 °C.
One recommended condition for manual soldering is that the tip of the soldering iron should
be <360 °C and the soldering contact time should be no longer than 3 seconds.
For uncoated MKT capacitors with lead spacings ≤10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 °C in the preheater phase
rapid cooling after soldering
Please refer to our Film Capacitors Data Book in case more details are needed.
Application note
A Y capacitor to be connected between AC lines and the Frame Ground (FG) has an effect of
emitting common mode current to the FG.Leak current corresponding in frequency and voltage to
the AC power supply flows in the Y capacitor.
As the capacity of a Y capacitor grows, leak current also increases. This can cause electric shock.
Therefore, UL and other safety standards restrict the capacity so that the amount of leak current
does not exceed a certain level. Usually, two Y capacitors are used, as shown in Figure below. As
AC lines are connected with capacitors, they are effective in reducing differential mode noises. In
particular, they are effective for high frequency ranges of 8 to 10 MHz.
Example of EMI suppression, typical application:
B32021 ... B32026
Y2/300VAC
Page 14 of 23Please read Cautions and warnings and
Important notes at the end of this document.