Datasheet

Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane
Shield Heat-absorbing board, (1.5 ±0.5) mm thick, between
capacitor body and liquid solder
Evaluation criteria:
Visual inspection No visible damage
ΔC/C
0
2% for MKT/MKP/MFP
5% for EMI suppression capacitors
tan δ As specified in sectional specification
1.3 General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T
max
. Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
B32021 ... B32026
Y2/300VAC
Page 12 of 23Please read Cautions and warnings and
Important notes at the end of this document.