Installation guide

Structure of This Guide
xiv About This Guide
Structure of This Guide
This guide is organized as follows:
This preface provides preliminary information to help you use this guide and a brief
summary of each chapter, defines conventions used in this document, and lists
technology and user guides that may help you set up and manage the DFE-Gold modules.
Chapter 1, Introduction, provides an overview of the DFE-Gold modules, and explains
how to contact Enterasys Networks for technical support.
Chapter 2, Network Requirements, provides an overview of the network requirements
that must be met before installing a DFE-Gold module.
Chapter 3, Installation, provides instructions on how to install the DFE-Gold module into
a Matrix N3, Matrix N7, or Matrix E7 chassis, install an optional Ethernet interface
module and Mini-GBICs, and connect segments to the DFE-Gold module and any of its
installed options. Also included in this chapter are important guidelines that must be
followed when installing DFE modules into a chassis.
Chapter 4, Troubleshooting, describes the function of the LANVIEW
®
LEDs and
provides troubleshooting procedures to help diagnose switch operational and related
network problems.
Appendix A, Specifications, contains information on port operating specifications,
connector pinouts, environmental requirements, and physical properties of the DFE
modules, optional 7G-6MGBIC Ethernet interface module, Mini-GBICs, and the media
they support. Also provided are optical specifications and operating range for
Mini-GBICs, and regulatory compliance information.
Appendix B, Mode Switch Bank Settings and Optional Installations, describes how to
access the Mode Switch Bank and describes how to use its switches to clear NVRAM of all
user-entered parameters and reset them to the factory default settings, or clear the user-
entered passwords and reset them to the factory default settings. In either case, you can
Reenter your user settings. Also included in this appendix are the removal and
replacement procedures for the DIMM and DRAM SIMM memory modules.