User's Manual

USER MANUAL 1.34

STM 300 / STM 300C / STM 300U

4.9 Soldering information

STM 300 has to be soldered according to IPC/JEDEC J-STD-020C standard.

STM 300 shall be handled according to Moisture Sensitivity Level MSL4 which means a floor

time of 72 h. STM 300 may be soldered only once, since one time is already consumed at

production of the module itself.

Once the dry pack bag is opened, the desired quantity of units should be removed and the

bag resealed within two hours. If the bag is left open longer than 30 minutes the desiccant

should be replaced with dry desiccant. If devices have exceeded the specified floor life time

of 72 h, they may be baked according IPC/JEDEC J-STD-033B at max. 90°C for less than

60 h.

Devices packaged in moisture-proof packaging should be stored in ambient conditions not

exceeding temperatures of 40 °C or humidity levels of 90% r.h.

STM 300 modules have to be soldered within 6 months after delivery!