User's Manual

USER MANUAL 1.34

STM 300 / STM 300C / STM 300U

Solder paste top layer

The data above is also available as EAGLE library.

In order to ensure good solder quality a solder mask thickness of 150 µm is recommended.

In case a 120 µm solder mask is used, it is recommended to enlarge the solder print. The

pads on the solder print should then be 0.1 mm larger than the pad dimensions of the

module as specified in chapter 2.3. (not relative to the above drawing).

Nevertheless an application and production specific test regarding the amount of soldering

paste should be performed to find optimum parameters.