Datasheet
DocID026906 Rev 3 13/27
SP1ML Hardware design
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2.4 Recommended footprint
Figure 5. Recommended footprint
2.5 Module reflow installation
The SP1ML is a surface mount module supplied on a 16-pin, 4-layer PCB. The final
assembly recommended reflow profile is indicated below, based on IPC/JEDEC JSTD-
020C, July 2004 recommendations.
PP
PP
PP
PP
PP
PP
*63*60'
Table 8. Soldering profile
Profile feature Lead-free assembly
Average ramp-up rate (T
SMAX
to T
P
) 3 °C/sec max
Preheat:
– Temperature min. (T
S
min.)
– Temperature max. (T
S
max.)
– Time (t
s
min. to t
s
max.)(t
s
)
150 °C
200 °C
60-100 sec