Instruction manual

NGA 2000 MLT Hardware
CONTENTS
V
Emerson Process Management GmbH & Co. OHG
Instruction Manual
90002929
07/2006
11. Test Procedure / Test Points ....................................................... 11 - 1
11.1 Signal processing ........................................................................... 11 - 1
11.1.1 Internal Voltage Supply ................................................................ 11 - 2
11.1.2 IR Source ..................................................................................... 11 - 2
11.1.3 Chopper ....................................................................................... 11 - 3
11.1.4 Unamplified Measuring Signal at Detector ................................... 11 - 3
11.1.5 Signal Processing on PCB “PSV” ................................................ 11 - 4
11.1.6 Physical Zero Alignment .............................................................. 11 - 5
11.1.6.1 IR Measurement......................................................................... 11 - 5
11.1.6.2 Paramagnetic Oxygen Measurement ......................................... 11 - 5
11.1.6.3 Electrochemical Oxygen Measurement (EO2) ........................... 11 - 5
11.2 Heating Unit.................................................................................... 11 - 6
11.3 Troubleshooting Instructions for PCB DSP01 ................................ 11 - 7
11.3.1 Inspection of LEDs on component side of DSP01 ....................... 11 - 8
11.3.2 Inspection of soldering pads of DSP01 ...................................... 11 - 10
11.3.3 Evaluation .................................................................................. 11 - 11
11.3.4 Appendix .................................................................................... 11 - 12
11.3.4.1 Description of soldering pad DEF (LB3): .................................. 11 - 12
11.3.4.2 Definition of LEDs: ................................................................... 11 - 12
12. Removal / Replacement of Components .................................... 12 - 1
12.1 Removal / Replacement of PCBs (in preparation).......................... 12 - 1
12.1.1 Rear Mounting Slots (in preparation) ........................................... 12 - 1
12.1.2 Internal Slots (in preparation)....................................................... 12 - 1
12.2 Removal / Replacement of Operation Front Panel ......................... 12 - 2
12.3 Replacement of Buffer Battery on the ACU 02 ............................... 12 - 3
12.3.1 Removal of ACU 02 ..................................................................... 12 - 3
12.3.2 Replacement of Buffer Battery ..................................................... 12 - 4
12.3.3 Installation of ACU 02 .................................................................. 12 - 4
12.4 Fuses.............................................................................................. 12 - 5
12.4.1 MLT 2........................................................................................... 12 - 5
12.4.2 MLT 1 / 4...................................................................................... 12 - 6
12.5 Connect/Disconnect UV Source/Power Supply for UV Source ...... 12 - 7