Instruction manual

NGA 2000 MLT Hardware
CONTENTS
II
Emerson Process Management GmbH & Co. OHG
Instruction Manual
90002929
01/2007
1.4 MLT 1 ............................................................................................... 1 - 6
1.4.1 MLT 1 1/2 19" housing ................................................................... 1 - 6
1.4.2 MLT 1 ULCO ................................................................................ 1 - 11
1.4.3 MLT 1 Housing for platform mounting .......................................... 1 - 13
1.5 MLT 2 (Field Housing) .................................................................... 1 - 17
1.6 MLT 3 ............................................................................................. 1 - 21
1.6.1 MLT 3 (Gas purity measurement) ................................................. 1 - 23
1.6.2 MLT 3HT (high temperature measurement).......................................1 - 24
1.7 MLT 4 ............................................................................................. 1 - 26
1.8 CAT 200 ......................................................................................... 1 - 28
1.9 Internal Gas Paths .......................................................................... 1 - 32
1.9.1 Gas Path Material ........................................................................ 1 - 32
1.9.2 Gas Path Layout (internal tubing)................................................. 1 - 33
1.9.3 MLT 3 (gas purity measurement) ................................................. 1 - 34
1.10 Printed Circuit Boards .................................................................... 1 - 36
1.10.1 ICB (Inter-Connection Board) ....................................................... 1 - 37
1.10.2 PSV/PIC Combination ................................................................. 1 - 37
1.10.3 DSP (alternitavely to PSV/PIC Combination) .............................. 1 - 37
1.10.4 PIC (Physics Interface Card) ........................................................ 1 - 38
1.10.5 Digital Signal Processing Card (DSP) ......................................... 1 - 39
1.10.6 ACU ............................................................................................. 1 - 40
1.10.7 SIO (Standard Inputs-/Outputs) .................................................... 1 - 41
1.10.8 DIO (Digital In-/Outputs) ............................................................... 1 - 42
1.11 Network Termination ...................................................................... 1 - 43
1.12 Specifications at the Nameplate Label ........................................... 1 - 44
1.13 MLT 2HT (high temperature measurement)...................... ................ 1 - 46
2. Measuring Principle ....................................................................... 2 - 1
2.1 IR Measurement ............................................................................... 2 - 1
2.1.1 Opto - Pneumatic Measuring Principle........................................... 2 - 3
2.1.2 Interference Filter Correlation (IFC Principle) ................................ 2 - 4
2.2 UV Measurement.............................................................................. 2 - 6
2.3 Oxygen Measurement ...................................................................... 2 - 7
2.3.1 Paramagnetic Measurement (PO
2
)................................................. 2 - 7
2.3.2 Electrochemical Measurement (EO
2
) ........................................... 2 - 11
2.3.3 Trace Electrochemical Measurement (TEO
2
) ............................... 2 - 13
2.4 Thermal Conductivity ..................................................................... 2 - 15
2.4.1 Sensor Design ............................................................................. 2 - 15
2.4.2 Analysis Cell ................................................................................ 2 - 15
2.4.3 Measurement Method .................................................................. 2 - 16
3. (vacant)
4. (vacant)