Technical data

Thermal Validation
MVME6100 Single Board Computer Installation and Use (6806800D58E)
108
The preferred measurement location for a component may be junction, case, or air as specified
in the table. Junction temperature refers to the temperature measured by an on-chip thermal
device. Case temperature refers to the temperature at the top, center surface of the
component. Air temperature refers to the ambient temperature near the component.
Table B-1 Thermally Significant Components
Reference
Designator Generic Description
Max. Allowable
Component
Temperature (deg. C)
Measurement
Location
U3-U11, U64-
U72
DDR SDRAM 70 Air
U84, U95 Gigabit Ethernet Transceiver 129 Case
U82, U83 Cache 115 Case
U45, U46 Programmable Logic Device 70 Air
U32 PCI Bridge 70 Air
U20 Discovery II 110 Case
U15 Clock Generator 85 Air
U14, U22 Clock Buffer 85 Air
U12 MC7457RX, 1.267 GHz Processor 103 Case
U21 Tsi148 VME Bridge ASIC 100