Technical data

Hardware Preparation and Installation
MVME4100 Single Board Computer Installation and Use (6806800H18D)
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2.3.3 Thermal Requirements
The MVME4100 module requires a minimum air flow of 10 CFM uniformly distributed across
the board, with the airflow traveling from the heat sink to the PMC2 site, when operating at a
55 °C (131 °F) ambient temperature.
2.3.4 Thermally Significant Components
The following table summarizes components that exhibit significant temperature rises. These
are the components that should be monitored in order to assess thermal performance. The
table also supplies the component reference designator and the maximum allowable
operating temperature.
You can find components on the board by their reference designators as shown in Figure 2-1
and Figure 2-2 on the next page. Versions of the board that are not fully populated may not
contain some of these components.
The preferred measurement location for a component may be junction, case, or ambient as
specified in the table. Junction temperature refers to the temperature measured by an on-chip
thermal device. Case temperature refers to the temperature at the top, center surface of the
component. Air temperature refers to the ambient temperature near the component.
Table 2-4 Thermally Significant Components
Reference
Designator Generic Description
Maximum Allowable
Component Temperature
Measurement
Location
U12 Processor 105 °C (+221 °F) Junction
U4, U27 Gb Ethernet Transceivers 125 °C (+257 °F) Junction
U66 MRAM 115 °C (+239 °F) Junction
U24 VME Bridge 122 °C (+251.6 °F) Junction
U22, U25 PCI-X to PCI-X Bridge 125 °C (+257 °F) Junction
U67 PLD 90 °C (+194 °F) Junction
U21 CPLD 85 °C (+185 °) Junction
U2, U34, U35,
U36
Transceivers 150 °C (+302 °F) Junction
XJ1 DDR2 SDRAM 85 °C (+185 °) Case