Instruction manual

ControlWave Micro Instruction Manual (CI-ControlWave Micro)
3-2 I/O Modules Revised Jun-2013
Note: This step is beyond the scope of this manual. Refer to the
ControlWave Designer Programmer’s Handbook (D5125)
for further instructions.
Caution
Power down the ControlWave Micro before you install or remove any
I/O module. Shut down any processes the ControlWave Micro may be
managing (or switch them over manually or handle with another
controller). Perform any hardware configuration (wiring, jumper
configuration, and installation) only when the ControlWave Micro is
powered down.
Before any I/O modules can become operational, you must use
ControlWave Designer to configure and then download the application
(project).
Do not install any modules in the base or expansion housings until you
have mounted and grounded those housings at the designated
installation site.
To ensure safe use of this product, please review and follow the
instructions in the following supplemental documentation:
 Supplement Guide - ControlWave Site Considerations for
Equipment Installation, Grounding, and Wiring (S1400CW)
 ESDS Manual – Care and Handling of PC Boards and ESD
Sensitive Components (S14006)
3.1 Module Placement
You can place I/O modules in the base or expansion housing:
 3-slot base housing: supports one I/O module in slot 3.
 4-slot base housing: supports up to two I/O modules in slots 3 and 4.
 8-slot base housing: supports up to six I/O modules in slots 3
through 8.
 2-slot expansion housing: supports up to two I/O modules.
 4-slot expansion housing: supports up to four I/O modules.
 8-slot expansion housing: supports up to eight I/O modules.
Note: Some modules have placement restrictions. Note these in the
individual descriptions.
3.2 Wiring
With a few exceptions (noted in the module descriptions), I/O modules
support either “local termination” (field wiring connected directly to the
module’s removable terminal blocks) or “remote termination” (field
wiring connected to the remote headers under the module’s cover and
routed to a DIN-rail mounted terminal assembly and then to field
devices).