Instruction manual

ControlWave Micro Instruction Manual (CI-ControlWave Micro)
iv Contents Revised Jun-2013
3.9 Isolated Analog Output (AO) Module ...................................................................................... 3-29
3.10 Non-isolated Mixed I/O (MI/O) Module ................................................................................... 3-32
3.11 Isolated Vac Digital Input Module ........................................................................................... 3-38
3.12 Relay Isolated Vac/Vdc Digital Output Module ....................................................................... 3-40
3.13 Isolated Digital Input/Output (DI/O) Module ............................................................................ 3-42
3.14 Isolated Resistance Temperature Device (RTD) Input Module .............................................. 3-45
3.15 Isolated Low Level Analog Input (LLAI) Module ..................................................................... 3-48
3.16 Non-isolated HART
®
/BTI Interface Module ............................................................................. 3-53
Internally Sourced Transmitters ............................................................................................. 3-57
Externally Sourced Transmitters ............................................................................................ 3-58
3.17 IEC62591 Interface Module .................................................................................................... 3-61
Chapter 4 – Operation 4-1
4.1 Powering Up/Powering Down the ControlWave Micro ............................................................. 4-1
4.2 Setting the Operating Mode (Run/Remote/Local Switch or Mode Switch) ............................... 4-2
4.3 Communicating with the ControlWave Micro ............................................................................ 4-3
4.3.1 Default Comm Port Settings ......................................................................................... 4-3
4.3.2 Changing Port Settings ................................................................................................. 4-4
4.3.3 Collecting Data from the ControlWave Micro ................................................................ 4-5
4.4 Creating and Downloading an Application (ControlWave Project) ........................................... 4-5
4.5 Creating and Maintaining Backups ........................................................................................... 4-6
4.5.1 Creating a Zipped Project File (*.ZWT) For Backup ..................................................... 4-7
4.5.2 Saving Flash Configuration Parameters (*.FCP) .......................................................... 4-8
4.5.3 Backing up Data ............................................................................................................ 4-9
Chapter 5 – Service and Troubleshooting 5-1
5.1 Upgrading Firmware .................................................................................................................. 5-2
5.2 Removing or Replacing Components ....................................................................................... 5-5
5.2.1 Accessing Modules for Testing ..................................................................................... 5-5
5.2.2 Removing/Replacing the Bezel ..................................................................................... 5-6
5.2.3 Removing/Replacing the CPU Module ......................................................................... 5-6
5.2.4 Removing/Replacing the PSSM .................................................................................... 5-6
5.2.5 Removing/Replacing an I/O Module ............................................................................. 5-7
5.2.6 Removing/Replacing the Backup Battery ..................................................................... 5-7
5.2.7 Enabling / Disabling the Backup Battery ....................................................................... 5-9
5.3 General Troubleshooting Procedures ....................................................................................... 5-9
5.3.1 Checking LEDs ............................................................................................................. 5-9
5.3.2 Checking Wiring/Signals ............................................................................................. 5-16
5.3.3 Common Communication Configuration Problems ..................................................... 5-17
5.4 WINDIAG Diagnostic Utility ..................................................................................................... 5-17
5.4.1 Available Diagnostics .................................................................................................. 5-20
5.5 Core Updump .......................................................................................................................... 5-24
Appendix A – Special Instructions for Class I, Division 2 Hazardous Locations A-1
Appendix D – Modem Installation D-1
Appendix Z – Sources for Obtaining Material Safety Data Sheets Z-1
Index IND-1