Instruction manual
ControlWave Micro Instruction Manual (CI-ControlWave Micro)
Revised Jun-2013 Index IND-5
Relay Isolated Vac/Vdc DO .............................. 3-41
Remote termination ............................................ 3-3
Repair in field ...................................................... 5-5
RS-232 Ports .................................................... 2-23
Cables .......................................................... 2-24
RS-485 Ports .................................................... 2-28
Cables .......................................................... 2-27
configuration switch ...................................... 2-22
RTD Input Module
Isolated ......................................................... 3-46
wiring ........................................................ 3-46
Run/Remote/Local switch ................................... 4-2
Running diagnostic software............................. 5-17
S
SDRAM memory
amount ............................................................ 1-7
Service Tools ...................................................... 5-1
Site Considerations ............................................. 2-1
Soft Switches
lock/unlock switch ......................................... 2-21
use/ignore switch .......................................... 2-21
Software Tools .................................................. 1-10
Specifications
for temperature, humidty, vibration................. 2-2
SRAM memory
amount ............................................................ 1-7
control switch ................................................ 2-21
Switches
CPU .............................................................. 2-20
HART/BTI module ........................................ 3-60
Mode ............................................................... 4-2
Run/Remote/Local .......................................... 4-2
System Firmware Downloader............................ 5-2
T
Tables
1-1. CPU Module Configurations .................... 1-5
2-1. PSSM Switch SW1 ................................ 2-13
2-2. Power Requirements ............................. 2-14
2-3. CPU Module Switch SW1 ..................... 2-20
2-4. CPU Module Switch SW2 ..................... 2-21
2-5. RS-485 Configuration Siwtch ................ 2-22
2-6. RS-232 Connectors on CPU ................. 2-23
2-7. RS-232 Connectors on ECOM .............. 2-23
2-8. RS-232 Port Connector Pin Assignment2-24
2-9. RS-485 Connectors on CPU ................. 2-27
2-10. CPU Board Connector Summary ........ 2-27
2-11. RS-232 Connectors on ECOM ............ 2-27
2-12. RS-485 Port Connector Pin Assignment . 2-
28
2-13. RS-485 Network Connections ............. 2-28
2-14. Ethernet 10/100Base-T CPU Module Pin
Assignments ............................................... 2-30
3-1. Isolated DI Module General Characteristics
...................................................................... 3-6
3-2. Isolated DI Module Configurations .......... 3-6
3-3. Jumper Assignments - Isolated DI Module 3-
7
3-4. Isolated DO Module General Characteristics
.................................................................... 3-11
3-5. Isolated DO Module Configurations ...... 3-11
3-6. Jumper Assignments - Isolated DO Module
.................................................................... 3-12
3-7. Non-Isolated DI/DO Module General
Characteristics ............................................ 3-15
3-8. Non-Isolated DI/O Module Configurations 3-
15
3-9. Jumper Assignments - Non-isolated DI/O
Module ........................................................ 3-16
3-10. Non-Isolated AI/O and AI Module ....... 3-18
3-11. Non-Isolated AI/O Module Configurations
.................................................................... 3-19
3-12. Non-Isolated AI Module Configurations .. 3-
19
3-13. Jumper Assignments - Non-isolated AI/O
and AI Module ............................................ 3-19
3-14. High Speed Counter Module General
Characteristics ............................................ 3-22
3-15. High Speed Counter Module
Configurations ............................................
3-22
3-16. Jumper Assign
ments - Non-isolated HSC
Module ........................................................ 3-22
3-17. Isolated AI Module General Characteristics
.................................................................... 3-26
3-18. Isolated AI Module Configurations ...... 3-27
3-19. Jumper Assignments - Isolated AI Module
.................................................................... 3-27
3-20. Isolated AO Module Configurations .... 3-30
3-21. Jumper Assignments - Isolated AO Module
.................................................................... 3-30
3-22. Mixed I/O Module Configurations ........ 3-33
3-23. Jumper Assignments - Non-isolated MI/O
Module ........................................................ 3-34
3-24. Isolated Vac DI Module General
Characteristics ............................................ 3-39
3-25. Jumper Assignments - Isolated Vac DI
Module ........................................................ 3-39
3-26. Relay Isolated Vac/Vdc DO Module
Characteristics ............................................ 3-41
3-27. Jumper Assignments - Isolated Vac DI
Module ........................................................ 3-42
3-28. Isolated DI/O Module Characteristics .. 3-43
3-29. Jumper Assignments - Isolated Vac DI
Module ........................................................ 3-44
3-30. Isolated RTD Input Module General
Characteristics ............................................ 3-46
3-31. Isolated RTD Input Module Configurations
.................................................................... 3-46
3-32. Isolated LLAI Module Characteristics .. 3-49
3-33. Isolated LLAI Module Configurations .. 3-49
3-34. LLAI Module Input Accuracy and
Resolution ................................................... 3-51
3-35. LLAI Module RTD Error with CJC at 25C
.................................................................... 3-52