Specifications

Appendix A – PL Smart Transceiver Reference Designs
220 PL 3120/PL 3150/PL 3170 Power Line Smart Transceiver Data Book
Recommended Operating Conditions for Reference Designs with 2Ap-p Transmit Amplifier
Symbol Parameter Min Typ Max Unit
V
ARX
V
A
Supply Voltage - Receive Mode
12.0 15.0 18.0
V
V
ATX
V
A
Supply Voltage - Transmit Mode (1) C-band
A-band
14.25
12.0
15.0
15.0
18.0
18.0
V
V
T
A
Ambient Temperature (1) -40 25 85
°C
Electrical characteristics of Reference Designs with 2Ap-p Transmit Amplifier
(over recommended operating conditions)
Symbol Parameter Min Typ Max Unit
I
ARX
V
A
Supply Current - Receive Mode
350 500
μA
I
ATX
V
A
Supply Current - Transmit Mode
160 500 mA
V
OTX
Transmit Output Voltage C-band
A-band
10
8
Vp-p
I
TXLIM
Transmit Output Current Limit 2.0 Ap-p
Z
INRX
Input Impedance - Receive Mode
(with recommended RXCOMP inductor)
500
Ω
Z
OTX
Output Impedance - Transmit Mode 0.7
Ω
NOTE 1: The following formula must also be satisfied:
MAX
AMAX
ATXAVE
D6.5
T150
V
×
−
<
Where:
V
ATXAVE
= Average V
A
supply voltage while transmitting
T
AMAX
= Maximum ambient temperature (degrees C)
D
MAX
= Maximum transmit duty cycle of the device (expressed as a decimal number where 0.64 is the practical max)
The Importance of Using Development Support Kit
(DSK) Reference Designs
Each DSK reference design implements a very wide dynamic range circuit that is sensitive to layout variations. In the
same way that traces of radio PCB are part of the design, the traces, pads and copper pours of the Smart Transceiver
reference layouts are part of the design and must not be altered,. With the proper layout, each Smart Transceiver is
capable of receiving signals measured in hundreds of micro-volts (millionths of a volt). Even apparently minor changes
to the layout can compromise performance and render the device unsuitable for many applications.
Every Power Line Smart Transceiver transmits signals on the order of several volts and is capable of driving 1 to 2
amperes of current into a low-impedance power line. Careful circuit layout is required to ensure that heat is properly
dissipated and that the amplifier remains stable across the full range of operating conditions. Ordinary circuit layout
practices are not suitable for driving high frequency modulated signals at high currents. The combination of voltage and
current produced by the transmit amplifier results in significant heat which requires very careful component placement
and design of the PCB copper areas to achieve proper dissipation.