Operation Manual

Outline Diagrams
The diagrams at the right show the two package
styles that the ELM327 is available in.
The first shows our ELM327P product in what is
commonly called a ‘300 mil skinny DIP package’. It is
used for through hole applications.
The ELM327SM package shown at right is also
sometimes referred to as 300 mil, and is often called
an SOIC package. We have chosen to simply refer to
it as an SM (surface mount) package.
The drawings shown here provide the basic
dimensions for these ICs only. Please refer to the
following Microchip Technology Inc. documentation for
more detailed information:
Package Drawings and Dimensions Specification,
(document name en012702.pdf - 7.5MB).
Go to www.microchip.com, select ‘Design Support’
then ‘Documentation’ then ‘Packaging Specifications’,
or go directly to www.microchip.com/packaging
PIC18F2480/2580/4480/4580 Data Sheet,
(document name 39637d.pdf - 8.0MB).
Go to www.microchip.com, select ‘Design Support’
then ‘Documentation’ then ‘Data Sheets, and search
for 18F2480.
ELM327 is a registered trademark of Elm Electronics Inc.
All rights reserved. Copyright 2005 to 2014 by Elm Electronics Inc.
Every effort is made to verify the accuracy of information provided in this document, but no representation or warranty can be
given and no liability assumed by Elm Electronics with respect to the accuracy and/or use of any products or information
described in this document. Elm Electronics will not be responsible for any patent infringements arising from the use of these
products or information, and does not authorize or warrant the use of any Elm Electronics product in life support devices and/or
systems. Elm Electronics reserves the right to make changes to the device(s) described in this document in order to improve
reliability, function, or design.
Note: all dimensions shown are in mm.
2.54
ELM327P
max
10.92
7.24
7.50
ELM327SM
10.30
1.27
92 of 94
ELM327
ELM327DSJ Elm Electronics – Circuits for the Hobbyist
www.elmelectronics.com
ELM327 integrated circuits are 28 pin devices, available in either a 300 mil wide plastic (‘skinny’) DIP format or in a
300 mil (7.50 mm body) SOIC surface mount type of package. We do not offer an option for QFN packages.
To order, add the appropriate suffix to the part number:
300 mil 28 pin Plastic DIP..............................ELM327P 300 mil 28 pin SOIC....................................ELM327SM
Ordering Information