Datasheet

M2Y2G64CB8HC5N / M2Y2G64CB8HC9N
2GB: 256M x 64
Unbuffered DDR3 SDRAM DIMM
REV 1.1 8
01/2010
© NANYA TECHNOLOGY CORP.
NANYA TECHNOLOGY CORP. reserves the right to change Products and Specifications without notice.
Environmental Requirements
Symbol
Parameter
Rating
Units
Note
T
OPR
Module Operating Temperature Range (ambient)
0 to 55
°C
3
H
OPR
Operating Humidity (relative)
10 to 90
%
1
T
STG
Storage Temperature (Plastic)
-55 to 100
°C
1
H
STG
Storage Humidity (without condensation)
5 to 95
%
1
P
BAR
Barometric Pressure (operating & storage)
105 to 69
K Pascal
1, 2
Note:
1. Stresses greater than those listed may cause permanent damage to the device. This is a stress rating only and device functional
operation at or above the conditions indicated is not implied. Exposure to absolute maximum rating conditions for extended periods
may
affect reliability.
2. Up to 9850 ft.
3. The component maximum case temperature shall not exceed the value specified in the component spec.
Absolute Maximum DC Ratings
Symbol
Parameter
Rating
Units
Note
V
DD
Voltage on VDD pins relative to Vss
-0.4 V ~ 1.975 V
V
1, 3
V
DDQ
Voltage on VDDQ pins relative to Vss
-0.4 V ~ 1.975 V
V
1, 3
V
IN
, V
OUT
Voltage on I/O pins relative to Vss
-0.4 V ~ 1.975 V
V
1
T
STG
Storage Temperature
-55 to +100
°C
1, 2
Note:
1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability
2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions, please
refer to JESD51-2 standard.
3. VDD and VDDQ must be within 300 mV of each other at all times;and VREF must be not greater
Operating temperature Conditions
Symbol
Parameter
Rating
Units
Note
T
OPER
Normal Operating Temperature Range
0 to 85
°C
1, 2
Extended Temperature Range
85 to 95
°C
1, 3
Note:
1. Operating Temperature TOPER is the case surface temperature on the center / top side of the DRAM. For measurement conditions,
please refer to the JEDEC document JESD51-2.
2. The Normal Temperature Range specifies the temperatures where all DRAM specifications will be supported. During operation, the
DRAM case temperature must be maintained between 0 to 85 °C under all operating conditions
3. Some applications require operation of the DRAM in the Extended Temperature Range between 85 °C and 95 °C case temperature.
Full specifications are supported in this range, but the following additional conditions apply:
a) Refresh commands must be doubled in frequency, therefore reducing the Refresh interval tREFI to 3.9 μs. It is also possible to
specify a component with 1X refresh (tREFI to 7.8μs) in the Extended Temperature Range. Please refer to supplier data sheet
and/or the DIMM SPD for option availability.
b) If Self-Refresh operation is required in the Extended Temperature Range, then it is mandatory to either use the Manual
Self-Refresh mode with Extended Temperature Range capability (MR2 A6 = 0b and MR2 A7 = 1b) or enable the optional Auto
Self-Refresh mode (MR2 A6 = 1b and MR2 A7 = 0b). Please refer to the supplier data sheet and/or the DIMM SPD for Auto
Self-Refresh option availability, Extended Temperature Range support and tREFI requirements in the Extended Temperature
Range.