Datasheet

M2F1G64CBH4B5P/ M2F1G64CBH4B9P
M2F(X)2G64CB88B7N / M2F(X)2G64CB88BHN
M2F(X)4G64CB8HB5N / M2F(X)4G64CB8HB9N
1GB: 128M x 64 / 2GB: 256M x 64 / 4GB: 512M x 64
PC3-8500 / PC3-10600 / PC3-12800
Unbuffered DDR3 SDRAM DIMM
REV 1.0 8
05/2010
© NANYA TECHNOLOGY CORPORATION
NANYA reserves the right to change products and specifications without notice.
Serial Presence Detect [M2F1G64CBH4B5(9)P ,1GB – 1 Rank, 128Mx16 DDR3 SDRAMs]
Byte
Description
Serial PD Data Entry (Hex.)
-BE
-CG
0
CRC range, EEPROM bytes, bytes used
92
92
1
SPD revision
10
10
2
DRAM device type
0B
0B
3
Module type (form factor)
02
02
4
SDRAM Device density and banks
03
03
5
SDRAM device row and column count
11
11
6
Module minimum nominal voltage
00
00
7
Module ranks and device DQ count
02
02
8
ECC tag and module memory Bus width
03
03
9
Fine timebase dividend/divisor (in ps)
52
52
10
Medium timebase dividend
01
01
11
Medium timebase divisor
08
08
12
Minimum SDRAM cycle time (tCKmin)
0F
0C
13
Reserved
00
00
14
CAS latencies supported
1C
3C
15
CAS latencies supported
00
00
16
Minimum CAS latency time (tAAmin)
69
69
17
Minimum write recovery time (tWRmin)
78
78
18
Minimum CAS-to-CAS delay (tRCDmin)
69
69
19
Minimum Row Active to Row Active delay (tRRDmin)
50
3C
20
Minimum row Precharge delay (tRPmin)
69
69
21
Upper nibble for tRAS and tRC
11
11
22
Minimum Active-to-Precharge delay (tRASmin)
2C
20
23
Minimum Active-to-Active/Refresh delay (tRCmin)
95
89
24
Minimum refresh recovery delay (tRFCmin) LSB
00
00
25
Minimum refresh recovery delay (tRFCmin) MSB
05
05
26
Minimum internal Write-to-Read command delay (tWTRmin)
3C
3C
27
Minimum internal Read-to-Precharge command delay (tRTPmin)
3C
3C
28
Minimum four active window delay (tFAWmin) LSB
01
01
29
Minimum four active window delay (tFAWmin) MSB
90
68
30
SDRAM device output drivers supported
83
83
31
SDRAM device thermal and refresh options
05
05
32
Module Thermal Sensor
00
00
33
SDRAM Device Type
00
00
60
Module height (nominal)
0F
0F
61
Module thickness (Max)
01
01
62
Raw Card ID reference
02
02
63
DRAM address mapping edge connector
00
00
117
Module manufacture ID
83
83
118
Module manufacture ID
0B
0B
119-121
Module manufacturer Information
--
--
126
CRC
73
0D
127
CRC
F7
2E
128-145
Module part number
--
--
146
Module die revision
--
--
147
Module PCB revision
--
--
150-175
Manufacturer reserved
--
--
176-255
Intel Extreme Memory Profile(XMP)
--
--