Datasheet

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TBS
Thermal Bonding System
TBS is a two-part, thermally conductive epoxy system, designed for bonding applications at thermal interfaces.
It is ideal for use as a bonding medium in surface mounting assemblies and where the design of heat sinks does
not allow for welding or brazing techniques to be employed due to complexity or geometry of the fins.
 High bond strength and excellent adhesion; provides an alternative to welding techniques
 Very good thermal conductivity; optimum efficiency of heat dissipation
 Contains solid glass spheres (200-300 µm diameter); aids application by controlling the correct
coating thickness
 Room temperature curing; simple mixing and curing procedures for ease of use
Approvals RoHS Compliant (2015/863/EU): Yes
Typical Properties Colour (Part A): Blue
Colour (Part B): Cream
Viscosity @ 1rpm (Pa s) : 70-80
Mix Ratio (A:B): 3:1
Usable Life: 3 to 4 hours
Cure Time: 45 mins @ 100°C
75 mins @ 60°C
8 to 12 hrs @ room temperature - hard
48 hours @ room temperature - full cure
Cured Properties Cured Density (g/ml): 1.85
Thermal Conductivity: 1.1 W/m.K
Operating Temperature Range: -40°C to + 120°C
Deflection Temperature: 100°C
Electric Strength: 11 to 12 kV/mm
Volume Resistivity: 10
14
to 10
15
Ohms/cm
Tensile Strength: 2200N/cm
2
Modulus of Elasticity: 2 to 3 GN/m
2
0.29 - 0.435 x 106 lbf/in
2
Specific Heat Capacity: 0.5 cal/g/°C @ 30°C – Part A
0.35 cal/g/°C @ 30°C – Part B
Description Packaging Order Code Shelf Life
Thermal Bonding System 20 ml Twin Syringe System TBS20S 36 months
1kg Kit TBS01K 24 months