Datasheet

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HTCX

Non-Silicone Heat Transfer Compound Xtra

HTCX is an enhanced version of HTC featuring improved thermal conductivity, lower oil bleed, and lower

evaporation weight loss. It is recommended where the efficient and reliable thermal coupling of electronic

components or heat dissipation between any surfaces are required. HTCX is a non-silicone paste, suitable for

applications where silicones are prohibited, thus avoiding issues with silicone and low molecular weight siloxane

migration.

 High performance thermal management paste; designed for use as a thermal interface material

 Excellent stability; ideal for applications exposed to varying temperature and humidity conditions

 Based on a non-silicone oil; avoids issues with silicone and LMW siloxane migration

 Non-curing paste; allows simple and efficient rework of components if required

Approvals RoHS-2 Compliant (2011/65/EU): Yes

Typical Properties Colour: White

Base: Blend of synthetic fluids

Thermo-conductive Component: Powdered metal oxides

Density @ 20°C (g/ml): 2.61

Cone Penetration @ 20°C: 300

Viscosity at 1rpm (Pa s): 127-141

Thermal Conductivity (Guarded Hot Plate): 1.35 W/m.K (calculated)

Thermal Conductivity (Heat Flow): 0.90 W/m.K

Temperature Range: -50°C to +180°C*

Weight Loss after 96 hours @ 100°C: <0.40%

Permittivity @ 1 GHz: 4.2

Volume Resistivity: 1 x 10

Ohms-cm

Dielectric Strength: 42 kV/mm

*Application dependent; excursions to higher temperatures may be possible, testing in end-use conditions is advised.

Description Packaging Order Code Shelf Life

Heat Transfer Compund Xtra 35 ml Luer Lock Syringe HTCX35SL 48 months

100 gram Tube HTCX100T 48 months

700g Cartridge HTCX700G 72 months

1 Kg Bulk HTCX01K 72 months

12.5 Kg Bulk HTCX12.5K 48 months

Other packaging sizes for HTCX may be available upon request

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Page 1 HTCX Non-Silicone Heat Transfer Compound Xtra HTCX is an enhanced version of HTC featuring improved thermal conductivity, lower oil bleed, and lower evaporation weight loss. It is recommended where the efficient and reliable thermal coupling of electronic components or heat dissipation between any surfaces are required. HTCX is a non-silicone paste, suitable for applications where silicones are prohibited, thus avoiding issues with silicone and low molecular weight siloxane migration.
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Page 2 Operating Temperature – Additional Information HTCX High Temperature Testing 20 18 % Weight Loss 16 14 12 10 8 6 4 2 0 5 10 HTCX @ 150⁰C 20 30 Number of Days HTCX @ 180⁰C 40 50 HTCX @ 200⁰C The above graph is provided for guidance only; testing in application conditions is advised. Tests were conducted ‘open cup’ therefore enhancing the weight loss effect. Tests conducted under in-use conditions may produce significantly lower results.
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Page 3 It is important to note that the quality of application of a thermal paste can be as important as the thermal conductivity of the material applied; best results are achieved when a uniform, thin coat is applied between the mating surfaces. Apply a thin layer of compound to one of the contact surfaces using a brush, spatula, roller, automated system or screen printing technique. Ensure that the entire interface is covered to avoid hot-spots from forming.